Advantest America Corporation

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Sr. Manager - R&D Process Integration

at Advantest America Corporation

Posted: 10/2/2019
Job Reference #: 5000527496106

Job Description

Job Description

Responsibilities include:

  • Developing and integrating new processes involving electroplating, lithography, wet and dry etch, physical vapor deposition, planarization, SMT, die attach, for manufacturing advanced probe cards.
  • Leading the way in resolving all process and integration issues by working closely with all functional area managers and engineers.
  • Create and maintain travelers for all the components used in building advanced wafer test probe cards.
  • Develop and mature processes relating to multi-layer circuit fabrication.
  • Set up DOEs, track and document results, create and update project plans for all development activities.

Requirements

Requirements:

  • Masters / PhD in Engineering discipline or Physics and/or 10+ years experience in developing/integrating front end and/or backend MEMS or Semiconductor or PCB fab processes.
  • Ability to run complex technical projects and manage technical teams, a MUST!
  • Strong, independent problem-solving skills, FMEA and trouble-shooting skills, a MUST!
  • Prior track record of developing MEMS processes and process flows and successfully deploying them in manufacturing.
  • Hands on experience with at least a few of the following: Electroplating, photolithography, physical vapor deposition, planarization, SMT, wafer level packaging, PCB/flex circuit fabrication, flip chip bonding, lasers, etc
  • Prior experience in wafer level packaging and/or circuit fabrication with yield improvement
  • High proficiency with Microsoft Excel, a MUST!
  • Prior experience with specifying, sourcing and procuring high dollar capital equipment.
  • Experience with automation of fab processes and operating automated equipment.
  • Knowledge/experience of 6 sigma quality practices.

Additional Skills Preferred (but not required):

  • Knowledge or experience with PCB / flex circuit fabrication a big plus
  • Experience with programming is a plus.
  • Experience with electroless plating a plus.

 

Position Type

Regular

Additional Information

Location(s)

US-CA-Baldwin Park

Field of Activity

Research & Development